Ready-to-Use Solder Pastes for Jewellery Assembly and Repair
XBRAX® is a specialised range of ready-to-use solder pastes developed for the assembly and repair of gold, silver and platinum jewellery. Designed for both furnace applications and torch benchwork, XBRAX® ensures precise and reliable soldering performance across different manufacturing environments. Its semi-liquid consistency allows accurate positioning of the solder, enabling clean and controlled joining even in difficult-to-reach areas.
Engineered for Precision Jewellery Soldering
XBRAX® is developed to simplify and optimise jewellery soldering operations while improving process precision and consistency. Its formulation combines controlled melting behaviour, excellent wettability and accurate application, supporting cleaner and more reliable solder joints. The semi-liquid structure allows the solder paste to be positioned exactly where needed, reducing filler alloy usage and improving process control during assembly and repair operations. At the same time, the optimised metallurgical composition ensures excellent colour matching with the base alloy, minimising visible solder lines. Suitable for both manual and industrial applications, XBRAX® supports modern jewellery manufacturing with a more efficient and controlled soldering approach.
- Ready-to-use solder paste
- Excellent wettability and controlled metal flow
- Precise application in difficult-to-reach areas
- Reduced alloy consumption
- Excellent colour matching with jewellery alloys
Frequently Asked Questions
XBRAX® is supplied as a ready-to-use solder paste, allowing more precise application, improved process control and reduced material consumption compared to traditional solder wire.
XBRAX® is available in formulations specifically developed for different precious metals, including gold, silver and platinum alloys, ensuring optimal compatibility and reliable soldering performance.
No. XBRAX® is a complete solder paste consisting of precious metal alloy powder, an optimized flux system, and binding agents that ensure precise application and controlled solder flow. It is suitable for both torch and furace applications.